Shenzhen Lianchengfa Technology Co., Ltd.

Next, the editor of Liancheng will share with you what packaging technologies are available for LED displays?

1. Surface mount (SMD)

Surface mount (SMD) package is to solder single or multiple LED chips on a metal bracket with a plastic "cup" frame (the outer pins of the bracket are respectively connected to the P and N levels of the LED chips), and then the plastic frame The liquid epoxy resin or organic silica gel is encapsulated inside, and then baked at high temperature to form, and then cut and separated into a single surface mount package device.

2. The new integrated packaging technology IMD (four in one)

LED display companies have deep technical accumulation in the SMD mounting process, and the "four-in-one" package is a further development based on the inheritance of SMD packaging. SMD packages contain one pixel in one package, while "four-in-one" packages contain four pixels in one package. Although the four-in-one LED display adopts a new integrated packaging technology IMD (four-in-one), the process still uses the surface mount process.

The "4-in-1" Mini LED module IMD package combines the advantages of SMD and COB, and solves the problems of ink color consistency, seam, light leakage, maintenance, etc. It has the characteristics of high contrast, high integration, easy maintenance, and low cost. It's a better compromise on the road to smaller pitches. At present, the "four-in-one" Mini LED module uses a full-scale chip due to cost considerations. As packaging manufacturers make more requirements for chips, "six-in-one" and even "N-in-one" will be further launched. "plan.

3. COB packaging technology

COB packaging is a method of attaching a bare chip to an interconnect substrate with conductive or non-conductive glue, and then wire bonding to achieve its electrical connection. The COB package adopts integrated packaging technology. Since a single LED device is omitted, the SMD process is performed after packaging. It can effectively solve the problems of SMD package display screen, because the dot pitch is constantly shrinking, the process difficulty is increased, the yield is reduced, and the cost is increased. COB is easier to achieve small pitch.